Mechatronic Integrated Devices

Mechatronic integrated devices or Moulded Interconnect Devices MID, are injection-moulded circuit carriers that contain conductive tracks. They are used as nodes for mechatronic or electronic assemblies. 3D Mechatronic Integrated Devices can be moulded into almost any shape. They are often made from plastic, ceramic, or glass. Thermal, electronic, and mechanical functions can be integrated. Solutions for optical or fluidic functions can also be realised. Using 3D MID technology, we can enhance or transform a standard electronic circuit into a mechatronic assembly.

On the one hand, MID technology valued for its material and tooling savings in printed circuit board production. The versatile use of materials enables customised and environmentally friendly solutions. These contribute to reduced resource consumption and cost savings.

On the other hand, high flexibility is another key advantage. Since MID technology integrates mechanical and electronic functions, it allows the design of components in various forms and sizes. Designs are highly customisable and can include electromagnetic shielding.

Thanks to the flexible design of individual printed circuit boards, mechatronic integrated devices (MID) are used in a wide range of applications. These include:

• Automotive industry
• Medical technology
• Industrial automation
• Telecommunications

In industry MID technology is frequently used for antennas, lighting systems, and sensors. In medical technology, they are often used as LED lighting components in illumination systems—for example, in lighting systems for dental drills. Mechatronic integrated devices also play a role in the consumer goods sector. For example, they are used in electronic payment systems and headphones. MIDs are also commonly found in household appliances.

Due to their wide range of applications, the technology receives considerable support from public institutions. The research association ‘Räumliche Elektronische Baugruppen 3-D MID’ is a German organization dedicated to the promotion and research of MID technology. It specifically supports small and medium-sized enterprises (SMEs) in applying electronic assemblies.

Fundamentally, the term MID refers to the function of the component. Depending on the designation extension, the component may also indicate the manufacturing method. If a circuit carrier is manufactured in three dimensions, it is generally referred to as a “3D MID”. These are spatial, injection-moulded circuit carriers.

Various processes are used to manufacture mechatronic integrated devices. MID components can be manufactured using two-component injection moulding, hot stamping, or film back injection.

The most common method for manufacturing MIDs is laser direct structuring (LDS). A laser beam writes the planned paths of the conductor tracks directly onto the respective component. The technology makes it possible to define the carriers very finely and densely. A metallisation is created on the circuit board, which results in very good bonding between the plastic and the electronics. Another advantage of LDS is that very different thermoplastics can be used. The design is also very flexible. If the conductor path needs to be changed, the control system can be reprogrammed. This results in the efficient development of process chains.